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Public Seminars

The one-day workshops listed in On-Site Workshops are given as seminars and tutorials, sometimes in abbreviated and/or different format, at various industry conferences. The following seminars are scheduled at this time:

"Solder Joint Reliability-Part 4: Reliability Issues for Lead-Free Soldering: Solder Joints, Printed Wiring Boards & Components"
"Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (incl. Lead-Free Soldering Impact)"

IPC National Electronics Week, London, UK, June 19, 2008.
Contact: AlexandraCurtis@IPC.ORG

"Solder Joint Reliability-Part 4: Reliability Issues for Lead-Free Soldering: Solder Joints, Printed Wiring Boards & Components"

IPC National Electronics Week, Bochum, Germany, July 17-18, 2008.
Contact: thomas.ahrens@isit.fraunhofer

Additional workshops and locations in Europe during July 2008 depending on demand.
Contact: Engelmaier@AOL.COM

"Pb-Free Soldering Processes-Survival, Quality, Reliability"

SMTA International Conference, Orlando, FL, August 18, 2008.
Contact: JoAnn@SMTA.ORG

Solder Joint Reliability-Part 1: "Fundamentals in Solder Joint Reliability"
Solder Joint Reliability-Part 2: "Failure Mode and Root Cause Analyses (Fatigue, Brittle Fracture, ENIG)"
Solder Joint Reliability-Part 4: "Reliability Issues for Lead-Free Soldering: Solder Joints, Printed Wiring Boards & Components"

IPC Midwest Conference, Schaumburg, IL, September 21, 2008.
Contact: AlexandraCurtis@IPC.ORG

"How to Specify PCBs to Reliably Survive the RoHS-Mandated Lead-Free Soldering Processes"
"Interconnect Failures and Design for Reliability for Plated-Through Holes/Vias (incl. Lead-Free Soldering Impact)"
Solder Joint Reliability-Part 1: "Fundamentals in Solder Joint Reliability"
Solder Joint Reliability-Part 2: "Failure Mode and Root Cause Analyses (Fatigue, Brittle Fracture, ENIG)"
Solder Joint Reliability-Part 3: "Acceleration Models, Reliability Tests and Screening Procedures"
Solder Joint Reliability-Part 4: "Reliability Issues for Lead-Free Soldering: Solder Joints, Printed Wiring Boards & Components"

Germany and/or Austria, October 2008. Depends on demand.
Contact: Engelmaier@AOL.COM

Solder Joint Reliability-Part 1: "Fundamentals in Solder Joint Reliability"
Solder Joint Reliability-Part 4: "Reliability Issues for Lead-Free Soldering: Solder Joints, Printed Wiring Boards & Components"

IPC EXPO/APEX 2009, Las Vegas, CA, March 29 & 31, 2009.
Contact: AlexandraCurtis@IPC.ORG