List of Publications

1. SURFACE MOUNT TECHNOLOGY

SMT-40. Engelmaier, W., "Effects of Power Cycling on Leadless Chip Carrier Mounting Reliability and Technology," Proc. Int. Electronics Packaging Conf. (IEPS), San Diego, CA, November 1982, pp. 15-23.

SMT-42. Engelmaier, W., "Leadless Chip Carrier Attachment Reliability During Power Cycling," Proc. NEPCON/West, Anaheim, CA, March 1983, p. 297.

SMT-43. Engelmaier, W., "Effects of Power Cycling on Leadless Chip Carrier Mounting Reliability and Technology," Electronic Packaging & Production, Vol. 23, No. 4, April 1983, p. 58.

SMT-44. Engelmaier, W., "Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling," IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. CHMT-6, No. 3, September 1983, p. 232.

SMT-45. Engelmaier, W., "Predicting Surface Mount Attachment Reliability," IEPS Workshop, Boston, MA, June 1984.

SMT-46. Engelmaier, W., "Functional Cycles and Surface Mounting Attachment Reliability," Surface Mount Technology, ISHM Technical Monograph Series 6984-002, The International Society for Microelectronics, Silver Spring, MD, 1984, pp. 87-114; also in Thermal Management Concepts in Microelectronic Packaging, ISHM Technical Monograph Series 6984-003, The International Society for Microelectronics, Silver Spring, MD, 1984, p. 83; also in Circuit World, Vol. 11, No. 3, Spring 1985, p. 61; also in Proc. NEPCON/Osaka '85, Osaka, Japan, August 1985; also in Proc. INTERNEPCON/UK, Brighton, England, October 1985, p. 123.

SMT-47. Engelmaier, W., "Test Method Considerations for SMT Solder Joint Reliability," Proc. 4th Annual Int. Electronics Packaging Conf. (IEPS), Baltimore, MD, October 1984, pp. 360-369; also in Brazing & Soldering, No. 9, Autumn 1985, p. 40.

SMT-48. Engelmaier, W., "Solder Joint Reliability and Testing Considerations for Leaded Chip Carriers," Proc. NEPCON/West, Anaheim, CA, February, 1985, pp. 884-885; Presentation available on IEPS Videotape VR 001, Lead Compliance and Solder Integrity of Surface Mount Leaded Packages.

SMT-50. Engelmaier, W., "Interim Report on the Test Results of IEEE Compliant Lead Test Program," IEPS Videotape VR 004, IEEE Compliant Lead Task Force Results of Phase A, 1985.

SMT-51. Engelmaier, W., "IEEE Compliant Lead Task Force--Phase I: Correlation and Analysis of Solder Joint Fatigue Results Obtained at Different Cyclic Frequencies and Temperatures," Proc. 5th Annual Int. Electronics Packaging Conf. (IEPS), Orlando, FL, October 1985, p. 279; Presentation available on IEPS Videotape VR 002, Second Interim Report of the IEEE Compliant Lead Task Force.

SMT-52. Engelmaier, W., "MIL Specs Drive People in the Wrong Direction," Electronics, Vol. 58, No. 43, October 28, 1985, p. 57.

SMT-53. Engelmaier, W., "Soldered Joints: Reliability in a State of Flux," Electronic Design, Vol. 43, No. 2, January 23, 1986, p. 58.

SMT-55. Engelmaier, W., "Reliability in Surface Mounted Assemblies: Controlling the Thermal Expansion Mismatch Problem," Joint ISHM/BABS/IMF Surface Mount Technology Seminar, London, England, June 1986; also in Proc. ASME Winter Annual Meet., Boston, MA, December 1987; also in Proc. EIA/IPC Surface Mounting and Reflow Technology Conf.-SMART IV, Los Angeles, CA, January 1988; also in Proc. IEEE European IEMT-Electronic Manufacturing Technology Symposium, Neuilly Sur Seine, France, June 1988.

SMT-56. Engelmaier, W., "Are Present-Day MIL-Specs Adequate for SMT?" SMT Workshop, Microelectronics and Computer Technology Consortium (MCC), Austin, TX, July 1986.

SMT-57. Engelmaier, W., "Is Present-Day Accelerated Cycling Adequate for Surface Mount Attachment Reliability Evaluation?" IPC-TP-653, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, September 1986; also in Proc. IEEE Nat. Aerospace & Electronics Conf.-NAECON '88, Dayton, OH, May 1988.

SMT-58. Kotlowitz, R. W., and W. Engelmaier, "Impact of Lead Compliance on the Solder Attachment Reliability of Leaded Surface Mount Devices," Proc. 6th Annual Int. Electronics Packaging Conf. (IEPS), San Diego, CA, November 1986, p. 841.

SMT-61. Engelmaier, W., "Surface Mount Attachment Reliability of Clip-Leaded Ceramic Chip Carriers on FR-4 Circuit Boards," Proc. 7th Annual Int. Electronics Packaging Conf. (IEPS), Boston, MA, November 1987, p. 104; also in IEPS J., Vol. 9, No. 4, January 1988, p. 3; also in Proc. NEPCON/East, Boston, MA, June 1988, p. 121.

SMT-63. Engelmaier, W., "Zuverlässigkeit Oberflächenmontierter Keramischer Bauelementträger mit Beinchen auf FR-4-Leiterplatten," 4. Int. Koll. für Verbindungstechnik in der Elektronik, Fellbach, Germany, February 1988, p. 131.

SMT-64. Engelmaier, W., "The Importance of Continuous Monitoring for SMT Solder Joint Failures During Accelerated Fatigue Testing," Proc. IPC Spring Meet., Hollywood, FL, April 1988.

SMT-65. Engelmaier, W., "Surface Mount Solder Joint Reliability--A Complex Technical Challenge," Guest Editorial, Brazing & Soldering, No. 14, Spring 1988, p. 2.

SMT-66. Engelmaier, W., "A Solder Joint Reliability Test for Actual Use Conditions," Circuits Manufacturing, Vol. 28, No. 6, June 1988, p. H2.

SMT-68. Engelmaier, W., "Thermal-Fatigue Life Predictions for Surface-Mount Solder Joints," Test & Measurement World, Vol. 8, No. 10, October 1988, p. 14.

SMT-69. Engelmaier, W., "IEEE Compliant Lead Task Force--A Progress Report," Proc. 8th Annual Int. Electronics Packaging Conf. (IEPS), Dallas, TX, November 1988, pp. 891-895.

SMT-70. Engelmaier, W., " Surface Mount Solder Joint Reliability: Design and Testing," 9th Annual IEEE/AESS Symp. on Avionics Integrity (AVIP), Fairborn, OH, November 1988.

SMT-71. Engelmaier, W., "Hi-Rel SMT Solder Joints," Circuits Manufacturing, Vol. 28, No. 12, December 1988, p. H16.

SMT-72. Clech, J-P., W. Engelmaier, R. W. Kotlowitz, and J. A. Augis, "Surface Mount Solder Attachment Reliability Figures of Merit--'Design for Reliability' Tools," Proc. EIA/IPC Surface Mounting and Reflow Technology Conf.-SMART V, New Orleans, LA, January 1989; also in Proc. NEPCON/West '89, Anaheim, CA, March 1989, p. 206.

SMT-73. Engelmaier, W., "Surface Mount Solder Joint Long-Term Reliability: Design, Testing, Prediction," Soldering & Surface Mount Technology, Vol. 1, No. 1, February 1989, pp. 14-22; also in IPC Technical Paper IPC-TP-797, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, January 1989.

SMT-74. Engelmaier, W., "Wärmebedingte Ermüdungserscheinungen von Weichlötverbindungen an Oberflächenmontierbaren Bauelementen," Verbindungstechnik in der Elektronik, Vol. 1, No. 2, June 1989, pp. 92-95.

SMT-75. Clech, J-P., W. Engelmaier, R. W. Kotlowitz, and J. A. Augis, "Reliability Figures of Merit for Surface-Soldered Leadless Chip Carriers Compared to Leaded Packages," 39th Electronic Components Conf., Houston, TX, May 1989, p. 781; also in IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. CHMT-12, No. 4, December 1989, p. 449.

SMT-76. Engelmaier, W., "Designing High-Density Surface Mount Circuit Boards for Reliability and Manufacturability,". Proc. Naval Weapons Support Center Electronic Standard/Common Module Challenges Conf., Bloomington, IN, May 1989; also in Plenary Session, Proc. Int. Symp. on Microelectronics-ISHM, Baltimore, MD, October 1989, p. 12.

SMT-77. Engelmaier, W., and A. I. Attarwala, "Surface-Mount Attachment Reliability of Clip-Leaded Ceramic Chip Carriers on FR-4 Circuit Boards," IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. CHMT-12, No. 2, June 1989, pp. 284-296.

SMT-78. Engelmaier, W., "Design for Reliability: Tools for Surface Mount Solder Attachments," Proc. 3rd Annual Soldering Technology for Electronics Packaging at SUNY, Binghampton, NY, July 1989.

SMT-80. Engelmaier, W., "Performance Considerations: Thermal-Mechanical Effects," in Section 6: Soldering and Mounting Technology, Electronic Materials Handbook, Vol. 1, Packaging, ASM International, Materials Park, OH, 1989, pp. 740-753.

SMT-81. Engelmaier, W., "Surface Mount Attachment Reliability: Issues, Design, Testing, Prediction ." Workshop and Workshop Handout, January 1990.

SMT-82. Engelmaier, W., "The Use Environments of Electronic Assemblies and Their Impact on Surface Mount Solder Attachment Reliability," Proc. EIA/IPC Surface Mounting and Reflow Technology Conf.-SMART VI, Lake Buena Vista, FL, January 1990, pp. 129-147; also in Proc. NEPCON/West '90, Anaheim, CA, February 1990, p. 1305; also in Proc. I-Therm II, Las Vegas, NV, May 1990, p. 8; also in Proc. Printed Circuit World Conv. 5, Glasgow, Scotland, June 1990, p. C6/3-1; also in IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. CHMT-13, No. 4, December 1990, p. 903.

REL-84. Engelmaier, W., "Environmental Stress Screening and Use Environments - Their Impact on Solder Joint and Plated-Through-Hole Reliability," Proc. Int. Electronics Packaging Conf. (IEPS), Marlborough, MA, September 1990, p.388; also in Proc. 15th Ann. Electronic Manufacturing Seminar, China Lake, CA, February 1991, pp. 253-269; also in Proc. NEPCON West '91, Anaheim, CA, February 1991, pp. 67-80.

REL-87. Evans, J. W., H. Chernikoff, and W. Engelmaier, "SMT Reliability for Space Flight Applications," Surface Mount Technology, Vol. 4, No. 11, November 1990, p. 24.

REL-88. Engelmaier, W., "Component Reliability," Circuits Assembly, Vol. 2, No. 3, March 1991, p. 44.

SMT-89. Engelmaier, W., "Solder Attachment Reliability, Accelerated Testing and Result Evaluation," Chapter 17 in Solder Joint Reliability, J. Lau ed., Van Nostrand Reinhold, New York, April 1991, pp. 545 -587.

SMT-91. Engelmaier, W., "Reliability Figures of Merit for Surface Mount Solder Attachments of Components: 2nd Generation Generic Design Tools," Proc. Surface Mount International Conf., San Jose, CA, August 1991, pp. 1239-1243; also in Proc. SMTConWest, San Diego, CA, November 1991, pp. 23-34 ; also in Proc. 16th Ann. Electronics Manufacturing Sem., Naval Weapons Center, China Lake, CA, February 1992, pp. 153-171; also in Proc. SMTCon+MCM, Secaucus, NJ, April 1992, pp. 77-88.

SMT-92. Engelmaier, W., "Design for Reliability for Surface Mount Solder Attachments: Physics of Failure and Statistical Failure Distributions," Proc. Reliability Aspects in SMT Symp., ETH Zürich, Switzerland, September 1991.

SMT-93. Engelmaier, W., "Figures of Merit Design Tools for Surface Mount Solder Joint Reliability," Soldering & Surface Mount Technology, No. 10, February 1992, pp. 17-22.

SMT-95. Engelmaier, W., "Alloy 42-Not a Choice Material for Surface Mount Leads," 35th Annual IPC Meeting, Bal Harbour, FL, April 1992.

SMT-96. Engelmaier, W., "Reliability for Surface Mount Solder Joints: Physics and Statistics of Failure," Proc. Surface Mount International Conf., San Jose, CA, August-September 1992, pp. 433-444; also in Proc. Int. Electronics Packaging Conf. (IEPS), Austin TX, September 1992, pp. 575-587; also in Proc. NEPCON West '93, Anaheim, CA, February 1993, pp. 1783-1798; also in Proc. Hochschulkolloquium 'Weichlöten in Forschung und Praxis 1993,' Munich, March 1993, DVS-Bericht Band 153, pp. 149-160; also in Proc. Printed Circuit World Convention VI, San Francisco, May 1993, pp. T16/1-T16/10; also in Proc. NEPCON East '93, Boston, MA, June 1993, pp. 217-231.

SMT-97. Engelmaier, W., "Generic Reliability Figures of Merit Design Tools for Surface Mount Solder Attachments," IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. CHMT-16, No. 1, February 1993, pp. 103-112.

SMT-98. Engelmaier, W., "Design for Reliability of Surface Mount Solder Attachments," interConnection Technology, Vol. 9, No. 4, April 1993, pp. 16-21.

SMT-99. Engelmaier, W., "Assuring Long-Term Reliability Of Surface Mount Solder Joints For Military Avionics (AVIP) Applications," Proc. Surface Mount International Conf., San Jose, CA, August-September 1993, pp. 376-384.

SMT-100. Engelmaier, W., "Long-Term Surface Mount Solder Joint Reliability In Electronic Systems With Multiple Use Environments And A Multiplicity Of Components," Proc. ASME International Electronics Packaging Conf., Binghamton, NY, September-October 1993.

SMT-102. Engelmaier, W., "Solder Interconnects Component to Board," interConnection Technology, Vol. 10, No. 3, March 1994, pp. 16-18.

SMT-103. Engelmaier, W., "Long-Term Reliability Requirements And Their Assurance For Surface Mount Solder Joints For U.S. Air Force (AVIP) Avionics," Proc. 18th Ann. Electronics Manufacturing Sem., Naval Weapons Center, China Lake, CA, February 1994, pp. 151-165; also in Proc. NEPCON West '94, Anaheim, CA, February-March 1994, pp. 385-395; also in Proc. European Surface Mount Conf., Brighton, UK, November 1994, Paper C3.

SMT-105. Engelmaier, W., "Versuchsbeschleunigung für Surface-Mount-Lötverbindungen," Verbindungstechnik in der Elektronik, Vol. 6, No. 1, March 1994, pp. 13-21.

SMT-106. Engelmaier, W., "Components Materials Selection Crucial to Solder Joint Reliability," NEPCON Show Daily - Electronic Packaging & Production, June 14-16, 1994, p. 3.

SMT-108. Engelmaier, W., and B. Fuentes, "Alloy 42: A Material to be Avoided for Surface Mount Solder Component Leads and Lead Frames," Proc. Surface Mount International Conf., San Jose, CA, August-September 1994, pp. 644-655; also in Proc. Int. Electronics Packaging Conf. (IEPS), Atlanta, September 1994, pp. 503-516; also in Proc. 19th Ann. Electronics Manufacturing Sem., Naval Air Warfare Center, China Lake, CA, February 1995, pp. 5-20; also in Proc. NEPCON West '95, Anaheim, CA, February-March 1995, pp. 385-395; also in Soldering & Surface Mount Technology, No. 21, October 1995, pp. 20-25.

SMT-112. Engelmaier, W., and B. Fuentes, "Component Lead and Lead Frame Attachment Materials," Circuits Assembly, Vol. 6, No. 6, June 1995, pp. 72-75.

SMT-114. Engelmaier, W., "BGA and CGA Solder Attachments: Results of Low-Acceleration Test and Analysis," Proc. Surface Mount International Conf., San Jose, CA, August 1995, pp. 344-358; also in Proc. Int. Electronics Packaging Conf. (IEPS), San Diego, September 1995, pp. 758-774; also in Proc. 1995 Japan Int. Electronic Manufacturing Technology Sympf. (IEMT), Omiya, Japan, December 1995, pp. 218-227; also in Proc. NEPCON West '96, Anaheim, CA, February 1996, pp. 1020-1036; also in Proc. Printed Circuit World Convention VII, Basel, Switzerland, May 1996, pp. P14/i-P14/14; also in Soldering & Surface Mount Technology, No. 24, October 1996, pp. 25-31.

SMT-115. Engelmaier, W., and L. Turbini, "Design for Reliability in Advanced Electronic Packaging," Proc. Surface Mount International Conf., San Jose, CA, August 1995, pp. 844-879.

SMT-117. Engelmaier, W., "Qualitäts und Zuverlässigkeits Optimierung Durch Design für Zuverlässigkeit und Design für Herstellbarkeit," Proc. Productronica 95, Munich, Germany, November 1995, pp. 110-121.

SMT-119. Engelmaier, W., "Design for Reliability: Solder Attachments for BGAs and CGAs," Proc. IPC Ball Grid Array National Symp., San Diego, CA, January 1996.

SMT-122. Engelmaier, W., "Quality and Reliability Optimization Through Design for Reliability and Design for Manufacturability," Proc. Int. Electronics Packaging Conf. (IEPS), Austin, Texas, September 1996, pp. 81-93; also in Proc. NEPCON West '97, Anaheim, CA, February 1997, pp. 1197-1212.

SMT-124. Engelmaier, W., "Soldering: Why We're Still Struggling," Circuits Assembly, Vol. 8, No. 2, February 1997, pp. 68-72.

SMT-125. Engelmaier, W., "Solder Joints in Electronics: Design for Reliability," Keynote Address in Design and Reliability of Solders and Solder Interconnections, R. K. Mahidhara, et.al., ed., The Minerals, Metals & Materials Society, Warrendale, PA, February 1997, pp. 9-19.

SMT-129. Engelmaier, W., "Werner Engelmaier on Reliability: An Expert Looks at the Issues," Chip Scale Review, Vol. 2, No. 5, November-December 1998, pp. 40-42.

SMT-130. Engelmaier, W., Tracy Ragland, and Colin Charette, "Using AXI to Ensure Solder Joint Reliability," Circuits Assembly, Vol. 11, No. 12, December 2000, pp. 32-42.

SMT-131. Engelmaier, W., and Colin Charette, "Using Automated X-Ray Inspection to Improve Solder Joint Reliability," Proc. APEX Electronics Assembly Process Conf., San Diego, CA, January 2001, pp. EQ4-2 1-7.

REL-132. Engelmaier, W., "CSP Reliability Issues," Global SMT & Packaging, Vol. 1, No. 1, April 2001, p. 32.

REL-133. Engelmaier, W., "Soldering: Quality & Reliability Issues," Global SMT & Packaging, Vol. 1, No. 2, August 2001, pp. 52 - 53.

REL-135. Engelmaier, W., "X-Ray Inspection: Increased Reliability at Reduced Cost," Global SMT & Packaging, Vol. 1, No. 4, December 2001, p. 32.

REL-136. Engelmaier, W., "Solder Joint Fatigue Reliability-Part 1: Physics of Creep-Fatigue," Global SMT & Packaging, Vol. 2, No. 3, May 2002, pp. 33-34.

REL-137. Crawford. J. and W. Engelmaier, "Surface-Mount Solder Attachments," Circuits Assembly, Vol. 13, No. 7, July 2002, pp. 28-29.

REL-138. Engelmaier, W., "Solder Joint Reliability-Part 2: The New IPC-9701 Standard," Global SMT & Packaging, Vol. 2, No. 4, June/July 2002, pp. 34-35.

REL-139. Engelmaier, W., "Solder Joint Reliability-Part 3: Comparing Different Solder Fatigue Models," Global SMT & Packaging, Vol. 2, No. 5, August 2002, pp. 35-36.

REL-140. Engelmaier, W., "Detecting Interconnect Failures: ATC, ESS, HASS, IST- What do You Measure and How," Global SMT & Packaging, Vol. 3, No. 1, January/February 2003, pp. 33-34.

REL-141. Engelmaier, W., "Reliability Assurance Testing for Pb-Free Solder Products," Proc. Military and Space Electronics Conf., Los Angeles, CA, February 2003, pp. SEM#2 103-131.

REL-142. Engelmaier, W., "Of Ceramic Components: Failed Solder Joints, LLCCCs, 'Bulbous' Solder Joints, 'Super-Compliant' Leads, and Forgotten Lessons," Global SMT & Packaging, Vol. 3, No. 2, March 2003, pp. 42-43.

REL-143. Engelmaier, W., "Reliability of Lead-Free (LF) Solder Joints," Global SMT & Packaging, Vol. 3, No. 3, April 2003, pp. 36-38.

SOL-144. Engelmaier, W., "Solder Joint Formation & Intermetallic Compounds (IMCs)," Global SMT & Packaging, Vol. 3, No. 4, May 2003, pp. 26-28.

SOL-147. Engelmaier, W., "Soldering Pad Surfaces--Gold, Silver & Their IMCs: Solder Joint 'Embrittlement'," Global SMT & Packaging, Vol. 3, No. 6, September 2003, pp. 29-32.

REL-148. Engelmaier, W., "Reliability of Lead-Free (LF) Solder Joints Revisited," Global SMT & Packaging, Vol. 3, No. 7, October 2003, pp. 26-27.

SOL-149. Engelmaier, W., "The Changeable Grain Structures of Solder Joints," Global SMT & Packaging, Vol. 4, No. 1, December2003/January 2004, pp. 29-30.

2. SOLDERING PROCESSES

SOL-29. Engelmaier, W., "Transverse Joulean Heated Soldering Tool for Mass Terminations," Proc. NEPCON/West, Anaheim, CA, February 1979, pp. 228-235.

SOL-34. Engelmaier, W., "Transverse Joulean Heated Double-Sided Reflow Soldering Machine for Mass Terminations," Proc. NEPCON/West, Anaheim, CA, February 1981, pp. 333-339.

REL-133. Engelmaier, W., "Soldering: Quality & Reliability Issues," Global SMT & Packaging, Vol. 1, No. 2, August 2001, pp. 52 - 53.

REL-135. Engelmaier, W., "X-Ray Inspection: Increased Reliability at Reduced Cost," Global SMT & Packaging, Vol. 1, No. 4, December 2001, pp. 16 - 17.

SOL-144. Engelmaier, W., "Solder Joint Formation & Intermetallic Compounds (IMCs)," Global SMT & Packaging, Vol. 3, No. 4, May 2003, pp. 26-28.

SOL-147. Engelmaier, W., "Soldering Pad Surfaces--Gold, Silver & Their IMCs: Solder Joint 'Embrittlement'," Global SMT & Packaging, Vol. 3, No. 6, September 2003, pp. 29-32.

SOL-149. Engelmaier, W., "The Changeable Grain Structures of Solder Joints," Global SMT & Packaging, Vol. 4, No. 1, December2003/January 2004, pp. 29-30.

3. MULTI-LAYER BOARDS / PLATED-THROUGH -HOLES

MLB-67. Engelmaier, W., in "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards, " IPC Technical Report IPC-TR-579, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, September 1988.

MLB-79. Engelmaier, W., "Reliability Issue for High Aspect Ratio Plated Through Holes," Proc. 1989 IEEE/IEMT Symp., San Francisco, CA, September 1989.

REL-84. Engelmaier, W., "Environmental Stress Screening and Use Environments - Their Impact on Solder Joint and Plated-Through-Hole Reliability," Proc. Int. Electronics Packaging Conf. (IEPS), Marlborough, MA, September 1990, p. 388; also in Proc. 15th Ann. Electronic Manufacturing Seminar, China Lake, CA, February 1991, p. 253; also in Proc. NEPCON West '91, Anaheim, CA, February 1991, p. 67.

REL-86. Engelmaier, W., "Printed Circuit Board Yield and Reliability Through Design and Understanding," Proc. PCB EXPO '90/PRONIC, Paris, November 1990.

MLB-90. Engelmaier, W., "Manufacturing and Reliability Issues of Small-Diameter/High -Aspect-Ratio Plated-Through-Holes and Vias"." Workshop and Workshop–handout, August 1991.

REL-94. Bhandarkar, S. M., A. Dasgupta, D. Barker, M. Pecht, and W. Engelmaier, "Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures," ASME J. Electronic Packaging, Vol. 114, No. 1, March 1992, pp. 8-13.

REL-134. Engelmaier, W., "Printed Circuit Board Reliability Issues," Global SMT & Packaging, Vol. 1, No. 3, October 2001, p. 32.

4. MULTI-LAYER BOARDS / ELECTROPLATING

MLB-19. Engelmaier, W., T. Kessler, and A. Colucci, "Effects of Agitation by Forced Flow and Air Sparging on Electroplated Copper in Multilayer Board Plated-Through Holes," Proc. Electrochemical Soc. Meet., Dallas, TX, October 1975.

MLB-22. Engelmaier, W., "A 500 Gallon Experimental Pilot Electroplating Facility Provides A Scale-Up Link Between Laboratory Tests and Production Facilities," Proc. Electrochemical Soc. Meet., Washington, DC, May 1976.

MLB-23. Engelmaier, W., T. Kessler, and R. Alkire, "Current Distribution Leveling Resulting from Auxiliary Bipolar Electrodes," Proc. Electrochemical Soc. Meet., Atlanta, GA, October 1977; also in J. Electrochemical Soc., Vol. 125, No. 2, February 1978, p. 209.

MLB-24. Engelmaier, W., and T. Kessler, "Investigation of Agitation Effects on Electroplated Copper in Multilayer Board Plated-Through Holes in a Forced-Flow Plating Cell," J. Electrochemical Soc., Vol. 125, No. 1, January 1978, p. 36.

5. MULTI-LAYER BOARDS / LAMINATION

MLB-13. Engelmaier, W. "Some Thermal Conductivities of Materials Involved in Multilayer Printed Wiring Board Laminations," Bell Telephone Laboratories Technical Memorandum MM72-2411-6, August 31, 1972.

MLB-14. Engelmaier, W., "Thermal Characterization of Multilayer Printed Wiring Boards During Lamination," Proc. 11th IEEE Electrical/Electronics Insulation Conf., Chicago, IL, October 1973, p. 208; also in Proc. INTERNEPCON/UK, Brighton, England, October 1974, p. 46.

MLB-16. Engelmaier, W., and M. B. Roller, "Temperature-Viscosity-Time Profiles Provide Some Understanding of MLB Lamination," Proc. NEPCON/West, Anaheim, CA, February 1975, p. 86.

MLB-17. Engelmaier, W., and M. B. Roller, "Temperature-Viscosity-Time Profiles Support Empirical Rules Governing Multilayer Printed Wiring Board Lamination," Insulation/Circuits, Vol. 21, No. 4, April 1975, p. 43.

MLB-18. Engelmaier, W., "Thermal Characteristics of Multilayer Printed Wiring Boards During Lamination," IEEE Trans. on Electrical Insulation, Vol. EI-10, No. 3, September 1975, p. 98.

6. FLEXIBLE PRINTED WIRING

FLX-15. Engelmaier, W., "Improving the Design for Flexibility of Flex Circuits," Proc. INTERNEPCON/UK, Brighton, England, October 1974, p. 12.

FLX-20. Engelmaier, W., "Designing Flex Circuits for Improved Flex Life," Proc. 12th Electrical/Electronics Insulation Conf., Boston, MA, November 1975, p. 1.

FLX-21. Engelmaier, W., "On the Parametric Temperature/Humidity Dependence of Insulation Resistance of Covercoated Fine-Line Flexible Printed Wiring," Proc. NEPCON/West, Anaheim, CA, February 1976, p. 87.

FLX-25. Engelmaier, W., "Determination of Flex Circuit Ductility and Fatigue Behavior," Proc. NEPCON/West, Anaheim, CA, February 1978, p. 141.

FLX-26. Engelmaier, W., "A New Ductility and Flexural Fatigue Test Method for Copper Foil and Flexible Printed Wiring," IPC-TP-204, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, April 1978.

FLX-27. Engelmaier, W., "Fatigue Ductility for Foils and Flexible Printed Wiring," Program No. 01883D, HP-67/97 User's Library, Hewlett-Packard Co., Corvallis, OR, 1978.

FLX-28. Engelmaier, W., "Fatigue Behavior of Flex Cables and Circuits," Electronic Packaging and Production, Vol. 19, No. 2, February 1979, p. 110.

FLX-30. Engelmaier, W., "Flexural Fatigue and Ductility, Foil," Test Method 2.4.2.1, IPC Test Methods Manual IPC-TM-650, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, August 1980.

FLX-31. Engelmaier, W., "Flexural Fatigue and Ductility, Flexible Printed Wiring," Test Method 2.4.3.1, IPC Test Methods Manual IPC-TM-650, The Institute for Inter-connecting and Packaging Electronic Circuits, Lincolnwood, IL, August 1980.

FLX-32. Engelmaier, W., "Flexural Fatigue and Ductility, Flat Cable," Test Method 2.4.3.3, IPC Test Methods Manual IPC-TM-650, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, August 1980.

FLX-33. Engelmaier, W., "Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics," Test Method 2.4.3.2, IPC Test Methods Manual IPC-TM-650, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, December 1980.

FLX-35. Engelmaier, W., "Standard Test Method for Ductility Testing of Metallic Foil," ASTM E 796, Annual Book of ASTM Standards, ASTM, Philadelphia, PA, 1981.

FLX-36. Engelmaier, W., "Flexibility Considerations in the Design of Flexible Printed Wiring," Section 6.2.1.2, IPC Printed Wiring Design Guide IPC-D-330, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, January 1982.

FLX-38. Engelmaier, W., "A Method for the Determination of Ductility for Thin Metallic Materials," Formability of Metallic Materials 2000 A.D., ASTM STP 753, J. R. Newby and B. A. Niemeier, eds., ASTM, Philadelphia, PA, 1982, p. 279.

FLX-54. Engelmaier, W., "Results of IPC Copper Foil Ductility Round Robin Study," IPC-TR-484, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, April 1986; also in Testing of Metallic and Inorganic Coatings, ASTM STP 947, W. B. Harding and G. A. Di Bari, Eds., ASTM, Philadelphia, 1987, pp.66-95.

FLX-59. Engelmaier, W., and A. Wagner," Ductility Determination for Rolled Annealed Copper Foil," IPC-TP-651, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, April 1987.

FLX-60. Engelmaier, W., and A. Wagner, "Flexural Resistance, Fatigue Behavior and Ductility Determination of Flex Circuits on Kapton," IPC-TP-652, The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, April 1987.

FLX-62. Engelmaier, W., and A. Wagner, "Fatigue Behavior and Ductility Determination for Rolled Annealed Copper Foil and Flex Circuits on Kapton," Circuit World, Vol. 14, No. 2, January 1988, p. 30.

7. RELIABILITY / QUALITY / YIELD

REL-84. Engelmaier, W., "Environmental Stress Screening and Use Environments-Their Impact on Solder Joint and Plated-Through-Hole Reliability," Proc. Int. Electronics Packaging Conf. (IEPS), Marlborough, MA, September 1990, p.388; also in Proc. 15th Ann. Electronic Manufacturing Seminar, China Lake, CA, February 1991, p. 253; also in Proc. NEPCON West '91, Anaheim, CA, February 1991, p. 67.

REL-85. Engelmaier, W., "6 Sigma - Necessity for Production Yield, Unnecessary Impossibility Otherwise?" Proc. T/MRC (Technology/Marketing Research Council of The Institute for Interconnecting and Packaging Electronic Circuits) Meeting, Paris, November 1990.

SMT-87. Evans, J. W., H. Chernikoff, and W. Engelmaier, "SMT Reliability for Space Flight Applications," Surface Mount Technology, Vol. 4, No. 11, November 1990, p. 24.

REL-132. Engelmaier, W., "CSP Reliability Issues," Global SMT & Packaging, Vol. 1, No. 1, April 2001, p. 32.

REL-133. Engelmaier, W., "Soldering: Quality & Reliability Issues," Global SMT & Packaging, Vol. 1, No. 2, August 2001, pp. 52 - 53.

REL-134. Engelmaier, W., "Printed Circuit Board Reliability Issues," Global SMT & Packaging, Vol. 1, No. 3, October 2001, p. 32.

REL-135. Engelmaier, W., "X-Ray Inspection: Increased Reliability at Reduced Cost," Global SMT & Packaging, Vol. 1, No. 4, December 2001, p. 32.

REL-136. Engelmaier, W., "Solder Joint Fatigue Reliability-Part 1: Physics of Creep-Fatigue," Global SMT & Packaging, Vol. 2, No. 3, May 2002, pp. 33-34.

REL-137. Engelmaier, W., "Solder Joint Reliability-Part 2: The New IPC-9701 Standard," Global SMT & Packaging, Vol. 2, No. 4, June/July 2002, pp. 34-35.

REL-138. Crawford. J. and W. Engelmaier, "Surface-Mount Solder Attachments," Circuits Assembly, Vol. 13, No. 7, July 2002, pp. 28-29.

REL-139. Engelmaier, W., "Solder Joint Reliability-Part 3: Comparing Different Solder Fatigue models," Global SMT & Packaging, Vol. 2, No. 5, August 2002, pp. 35-36.

REL-140. Engelmaier, W., "Detecting Interconnect Failures: ATC, ESS, HASS, IST- What do You Measure and How," Global SMT & Packaging, Vol. 3, No. 1, January/February 2003, pp. 33-34.

REL-141. Engelmaier, W., "Reliability Assurance Testing for Pb-Free Solder Products," Proc. Military and Space Electronics Conf., Los Angeles, CA, February 2003, pp. SEM#2 103-131.

REL-142. Engelmaier, W., "Of Ceramic Components: Failed Solder Joints, LLCCCs, 'Bulbous' Solder Joints, 'Super-Compliant' Leads, and Forgotten Lessons," Global SMT & Packaging, Vol. 3, No. 2, March 2003, pp. 42-43.

REL-143. Engelmaier, W., "Reliability of Lead-Free (LF) Solder Joints," Global SMT & Packaging, Vol. 3, No. 3, April 2003, pp. 36-38.

SOL-144. Engelmaier, W., "Solder Joint Formation & Intermetallic Compounds (IMCs)," Global SMT & Packaging, Vol. 3, No. 4, May 2003, pp. 26-28.

SOL-147. Engelmaier, W., "Soldering Pad Surfaces--Gold, Silver & Their IMCs: Solder Joint 'Embrittlement'," Global SMT & Packaging, Vol. 3, No. 6, September 2003, pp. 29-32.

REL-148. Engelmaier, W., "Reliability of Lead-Free (LF) Solder Joints Revisited," Global SMT & Packaging, Vol. 3, No. 7, October 2003, pp. 26-27.

SOL-149. Engelmaier, W., "The Changeable Grain Structures of Solder Joints," Global SMT & Packaging, Vol. 4, No. 1, December2003/January 2004, pp. 29-30.

8.FATIGUE-GENERAL

FAT-06. Engelmaier, W. "Fatigue Behavior and Crack Propagation in 2024-T3 Aluminum Alloy in Ultrahigh Vacuum and Air," Trans. of the Metallurgical Soc. of AIME, Vol. 242, August 1968, p. 1713.

9. STRESS ANALYSIS

STR-10. Engelmaier, W. "Experimental Determination of Static Compressive Stresses in Wound Paper Capacitors," Bell Telephone Laboratories Technical Memorandum MM71-2411-1, May 7,1971.

10. HEAT TRANSFER

HTR-05. Engelmaier, W. "Determination of the Dissipable Power Per Gate on a High Alumina Substrate," Bell Telephone Laboratories Technical Memorandum MM67-5724-3, August 25, 1967.

HTR-09. Engelmaier, W. "Nodal Heat Transfer Analysis of Proposed PAR Phase-Shifter Diode Mount Designs," Proc. Heat Transfer and Thermal Design Symp., Whippany, NJ, March 1971, p. 153.

HTR-11. Engelmaier, W. "Thermal Behavior and Aging of Tantalum Nitride Thin Film Resistors Under Pulsed Operation," Proc. 21st IEEE Electronic Components Conf., Washington, DC, May 1971, p. 210.

11. MOLDED CIRCUIT BOARDS

MOL-37. Engelmaier, W., and P. Hubbauer, "Injection Molded Printed Wiring Boards," Proc. NEPCON/West, Anaheim, CA, February 1982, pp. 44-50.

MOL-41. Engelmaier, W., and D. C. Frisch, "Injection Molding Shapes New Dimensions for Boards," Electronics, Vol. 55, No. 25, December 15, 1982, pp. 155-158.

12. LUBRICATION

LUB-08. Engelmaier, W. "The Effects of Burnishing on the Wear-In and Wear-Life of Molybdenum Disulfide Powder Films," Lubrication Engineering, Vol. 25, November 1969, p. 442.

13. COMBUSTION

COM-03. Engelmaier, W., and E. C. Woodward, "Analysis of the Effects of Staging upon Reaction Rate Controlled Systems," Combustion and Flame, Vol. 10, May 1966, p. 206.

COM-12. Engelmaier, W., and E. C. Woodward, "Analysis of Multi-Stage Reaction Controlled Systems," J. Astronautical Sciences, Vol. 19, January 1971, p. 40.

14. THERMIONIC ENERGY CONVERSION

THE-01. Engelmaier, W., and R. E. Stickney, "Thermionic Emission from a Tungsten Monocrystal in Oxygen," Quarterly Progress Report No. 79, Research Laboratory of Electronics, M.I.T., October 15, 1965; also in Research on New Concepts in Energy Conversion Quarterly Technical Progress Report No. 8, August 15,1965.

THE-02. Engelmaier, W., and R. E. Stickney, "Thermionic and Absorption Characteristics of a Single-Crystal Tungsten Filament Exposed to Oxygen," Proc. 26th Annual Conf. on Physical Electronics, Cambridge, MA, March 1966.

THE-04. Engelmaier, W., and R. E. Stickney, "Thermionic Characteristics of a Single-Crystal Tungsten Filament Exposed to Oxygen," Quarterly Progress Report No. 82, Research Laboratory of Electronics, M.I.T., July 15, 1966.

THE-07. Engelmaier, W., and R. E. Stickney, "Adsorption Studies Based on Thermionic Emission Measurements: II. Oxygen on Single-Crystal Tungsten," Surface Science, Vol. 11, September 1968, p. 370.

15. EDITORIALS & Columns

FLX-39. Engelmaier, W., "Flexible Interconnections," Guest Editorial, AMP Designer Digest, Vol. 25, AMP Inc., Harrisburg, PA, October 1982.

SMT-49. Engelmaier, W., "An Ocean Apart, But Only a Phone Call Away; Or is it the Other Way Around?" Guest Editorial, Circuit World, Vol. 11, No. 4, Summer 1985, p. 2.

REL-83. Engelmaier, W., "DoD, NASA, and Industry: Let's Get It Together Now," Military & Aerospace Electronics, Vol. 1, No. 7, July 1990, p. 20.

EDI-101. Engelmaier, W., "Brief aus den USA," Verbindungstechnik in der Elektronik, Vol. 5, No. 4, December 1993, p. 157.

EDI-104. Engelmaier, W., "Brief aus den USA (No. 2)," Verbindungstechnik in der Elektronik, Vol. 6, No. 1, March 1994, p. 7.

EDI-107. Engelmaier, W., "Brief aus den USA (No. 3)," Verbindungstechnik in der Elektronik, Vol. 6, No. 2, June 1994, p. 67.

EDI-109. Engelmaier, W., "Brief aus den USA (No. 4)," Verbindungstechnik in der Elektronik, Vol. 6, No. 3, September 1994, p. 135.

EDI-110. Engelmaier, W., "Brief aus den USA (No. 5)," Verbindungstechnik in der Elektronik, Vol. 6, No. 4, December 1994, pp. 202-203.

EDI-111. Engelmaier, W., "Brief aus den USA (No. 6)," Verbindungstechnik in der Elektronik, Vol. 7, No. 1, March 1995, pp. 8-9.

EDI-113. Engelmaier, W., "Brief aus den USA (No. 7)," Verbindungstechnik in der Elektronik, Vol. 7, No. 2, June 1995, pp. 88-89.

EDI-116. Engelmaier, W., "Brief aus den USA (No. 8)," Verbindungstechnik in der Elektronik, Vol. 7, No. 3, September 1995, pp. 176-177.

EDI-118. Engelmaier, W., "Brief aus den USA (No. 9)," Verbindungstechnik in der Elektronik, Vol. 7, No. 4, December 1995, pp. 260-261.

EDI-120. Engelmaier, W., "Brief aus den USA (No. 10)," Verbindungstechnik in der Elektronik, Vol. 8, No. 1, February 1996, pp. 10-11.

EDI-121. Engelmaier, W., "Brief aus den USA (No. 11)," Verbindungstechnik in der Elektronik, Vol. 8, No. 3, June 1996, pp. 126-127.

EDI-123. Engelmaier, W., "Brief aus den USA (No. 12)," Verbindungstechnik in der Elektronik, Vol. 8, No. 6, December 1996, pp. 308-309.

EDI-126. Engelmaier, W., "Brief aus den USA (No. 13)," Verbindungstechnik in der Elektronik, Vol. 9, No. 3, June 1997, pp. 125-126.

EDI-127. Engelmaier, W., "Brief aus den USA (No. 14)," Verbindungstechnik in der Elektronik, Vol. 9, No. 6, December 1997, pp. 304-305.

EDI-128. Engelmaier, W., "Brief aus den USA (No. 15)," Verbindungstechnik in der Elektronik, Vol. 10, No. 3, June 1998, pp. 116-117.