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Engelmaier Associates, L.C. provides services to OEMs, printed circuit board (PCB) manufacturers, PCB subcontract assembly companies and end users, such as telecommunications and computer companies, the automotive industry, and the military, in the areas of design for reliability, accelerated reliability testing, reliability prediction, design for manufacturability and quality, processing effects, environmental stress screening, and failure cause analysis, for solder joints, plated-through holes/vias (PTHs/PTVs), and flexible circuitry.

Solder joint reliability is becoming an ever more important issue with the advent of new surface mount packages, which are characterized by larger sizes, finer pitches, or problematic material combinations which require an up-front 'Design for Reliability' to meet reliability requirements.

The packaging densities possible with surface mount technology (SMT) drive printed wiring board densities ever higher and thus PTH/PTV diameters ever smaller. This, together with severe assembly steps, has led to infant mortality and reliability problems with PTH/PTV interconnect structures.

We bring over 49 years of practical engineering experience in design, process and product evaluation, materials and assembly testing, failure analysis and reliability assessment to bear on your electronic packaging needs. We provide cost effective and timely input and solutions to your problems.